-40%
Esec 3088 Wirebonder Ball-Wedge Bonder
Esec 3088 Wirebonder Ball-Wedge Bonder
Esec 3088 Wirebonder Ball-Wedge Bonder
Esec 3088 Wirebonder Ball-Wedge Bonder
Esec 3088 Wirebonder Ball-Wedge Bonder
Esec 3088 Wirebonder Ball-Wedge Bonder
Esec 3088 Wirebonder Ball-Wedge Bonder

Esec 3088 Wirebonder Ball-Wedge Bonder

$ 2640

Availability: 100 in stock
  • Brand: ESEC
  • Condition: Used
  • Equipment Type: Wire Bonder
  • Restocking Fee: No
  • MPN: WB 3088
  • Return shipping will be paid by: Buyer
  • Refund will be given as: Money back or replacement (buyer's choice)
  • All returns accepted: Returns Accepted
  • Item must be returned within: 30 Days

    Description

    ESEC 3088 Ball-Wedge Bonder
    Config W133
    Serial no,: 306028
    Manufactured Aug 2000
    Model:
    Specifications:
    Ultrasonic frequency: 130 kHz
    Cu-kit with movable electrode
    Sprint UPH: 10 wires/second (UPH depends on material/process requirements)
    Maximum bonding area: 52 mm x 70 mm (2" x 2.7")
    Process zone temperature: ambient to 300°C
    Various looping profiles
    Application
    Gold wire (17.5µm – 50µm diameter) and copper wire (17.5µm – 25µm diameter) ball-wedge bonding
    Made in Switzerland
    c
    ame from a working environment,
    TriQuint
    Semiconductor
    unit was serviced 2016
    we are unable to fully test
    Sold as is
    Buyers are welcome to inspect/ test here
    buyer is responsible for freight shipping
    freight cost is an estimate*
    Send message with your location for more accurate quote
    weight: 1260 lbs
    approximate dimensions: 4 x 4 x 4 ft
    location: Alta Loma CA, 91701